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      1. *金鵬電子制程能力
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        JINPENG Manufacturing Capacity

        金鵬電子制程能力

        Monthly Capacity:200,000㎡

        月產能:20萬㎡

        LAYER: ≤10

        層數:≤10層

        Product type: Conventional FR-4, CEM-1, aluminum based, soft board, hard and soft board and other unconventional plates

        產品類型:常規FR-4、CEM-1、鋁基、軟板、軟硬結合等

        Board Material

        原材料

        Base Material:KB/ SYTECH

        Aluminum substrate: CSEM / WAZAM

        常規板材:建滔/生益

        鋁基板:清晰/華正

        Printing ink:TAIYO/Eternal/ABQ/Sekisui

        油墨:太陽、長興、板橋、積水

        Surface Finishing

        表面處理

        HASL,HASL Leadfree,ENIG(ImmersionGold),OSP(Entek),
        Immersion Tin,Immercial Silver,Hard Gold

        鉛錫,純錫,化金,OSP,化錫,化銀,鍍硬金

        Selective Surface Finishing

        選擇性表面處理

        ENIG(Immersion Gold)+OSP,ENIG+Gold Finger,Immersion Silver+Glod Finger,Immersion Tin+Gold Finger

        化金+OSP,化金+金手指,化銀+金手指,化錫+金手指

        Technical Specification

        技術參數

        Min Line Width:4/4mil

        最小線寬:4/4mil

        Min Hole Size:0.25mm(Mechanical Drill)

        最小孔徑:0.25mm(機械鉆孔)

        Min Annular Ring:5mil

        最小焊環:5mil

        Max Copper Thickness:60Z(Outer Layer)

        最厚銅厚:60Z(外層)

        Max Panel Size:540mm*650mm

        最大成品尺寸:540mm*650mm

        Board Thickness:0.4nn-3.0mm

        板厚:0.4mm-3.0mm

        Min Solder Mask Bridge≧0.08mm

        阻焊橋:≧0.08mm

        Aspect ratio:7:1

        板厚孔徑比(縱橫比):7:1

        Pluggine Vias Capabioity:0.2-0.6mm

        塞孔能力:0.2-0.6mm

        Impedance Control:10%

        阻抗控能:±10%

        Tolerance

        公差

        Plated Holes Tolerance:±0.08mm(min±0.05)

        金屬化孔:±0.08mm(極限±0.05)

        Non-Plated Hole Tolerance:  ±0.05mm(min+0/-0.075mm or+0.075/-0mm)

        非金屬化孔:±0.05mm(極限+0/-0.075mm or+0.075/-0mm)

        Outline Tolerance:±0.15mm(min±0.10mm)

        外形公差:±0.15mm(極限±0.10mm)

        Functional Test

        功能測試

        Insulating Resisitance:50ohms(normality)

        絕緣電阻:50ohms(常態)

        Peel Off Strength:1.4N/mm

        可剝離強度:1.4N/mm

        Thermal Stress Test:260 degree,20seconds

        熱沖擊測試:260℃,20秒

        Soder Mask Hardness:≧6H

        阻焊劑硬度:≧6H


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